DESCRIPTION

UP-78 Paste flux can be used for touch up or rework in conjunction with the use of Alpha UP-78 solder paste. This paste flux is identical to the paste flux used to manufacture UP-78 solder paste.

FEATURES AND BENEFITS

            Designed for use with OSP protected copper pads

            Fully compatible with UP-78 solder paste residue

 

PHYSICAL, CHEMICAL AND ELECTRICAL PROPERTIES

Color Pale, Off White

Specific Gravity 0.99 (g/cc)

Viscosity (Spiral/Malcolm), 10 RPM @ 25°C 270-470 Poise

Acid Number 95-105 mg KOH/g

Corrosivity, Copper Mirror Pass (L)

Halide Content 550ppm by IC

Passes Ag-Chromate test

Water Content 0.2% Max

AVAILABILITY

UP-78 Paste Flux is available in 30cc syringes, 100 and 125 gram jars, and 6” cartridges.

APPLICATIONS

Formulated for standard and fine pitch printing through stencil apertures. Suitable for use across a wide variety of process settings, including rework applications with BGA’s and other components. UP-78 Paste Flux is especially suitable for printing on assemblies that have OSP coated copper pads.

REFLOW

Clean, dry air or Nitrogen atmosphere. A straight ramp profile at 0.8 – 1.2°C per second ramp rate is recommended. High density assemblies may require preheating within the profile and may be accomplished as follows:

            Ramp @ 60 – 120°C/min to 145 - 160°C.

            Dwell @ 145 - 160°C for 0.5 – 2.0 minutes.

            Ramp @ 1 - 2°C/sec to 210 - 225°C peak temperature. Time above 183°C, 45 – 70 seconds.

            Ramp down to R. T. @ 1.5 – 2.0°C/sec. 

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